products menu
recent posts
Challenges in the Semiconductor Industry Amid Global Tariff Wars
Trends in the Semiconductor Industry and SFE’s Strategic Growth
Get in Touch with SFE
Our experts at SFE are ready to provide tailored guidance and technical insights to help you achieve higher efficiency, precision, and scalability.
- sfe@super-sfe.co.kr
- +82 041-566-3070
Flip Chip Bonder: SUPER-170
Superior Mounting Speed
Achieves an excellent mounting tact time of 0.6 seconds per chip, with a bonding time of just 0.2 seconds, ensuring high-speed production.
Auto-Leveling & Calibration
Features auto pick-up level adjustment and auto bonding level reaching, along with auto bonding force calibration for precise operations.
User-Friendly Interface
Easy teaching graphics allow quick setup and adjustment of bonding parameters.
Automated Maintenance
Equipped with auto ejector needle measuring, auto nozzle grinding, and auto nozzle length checking to ensure consistent performance.
Space-Efficient Design
Designed with a compact footprint, maximizing space utilization in production facilities.
General Specification
| Index Time | 0.7 sec/chip(Including 0.1sec Process Time) |
|---|---|
| UPH | 5,100 ea/hour |
| Lead Frame | Horizontal Lead Frame Or Substrate |
| Bonding Method | Supersonic & Thermal Pressure Bonding |
| Chip Size | 0.1 ~ 2.0 mm |
| Bonding Accuracy | XY : ±5um |
| Bonding Force | 1N ~ 30N Digital Control |
Material Size
| Substrate | Width : 50~100mm |
|---|---|
| Magazine | Customer Specification |
| Wafer | 4 Inch |
Material Size
| Power | AC220V 50/60Hz 1Φ |
|---|---|
| Dimension | 900(W) 1000(L) 1930(H) |
| Weight | 1,400Kg |
Unit Specification
| Loader | Substrate 3ea Supply |
|---|---|
| Feeder | Loading Using Linear Motor |
| Unloader | Magazine Vertical Drive |
| Wafer Stage | 4 Inch Wafer Expansion |
| Chip Recognition | 9ea Chip Mode |
| Pick up & Flip Head | Chip Pick Up Check By Vacuum |
| Nozzle Level Auto Detection | |
| Head | Bonding Force Controlled by Voice coil |
| One Touch Collect Switch Type | |
| Chip Pick Up Check By Vacuum | |
| Bonding Table | Substrate Absorption By Vacuum |
| Load Cell / Heater | |
| Eject | Sheet Absorption By Vacuum |
| Vision | 4ch Vision System |
Flip Chip Bonder: SUPER-170
High-Speed Processing
Achieves an index time of 0.20 sec/cycle and an ultra-high throughput (UPH) of 16,000 units/hour
Precision Bonding Technology
±25μm bonding accuracy with digitally controlled bonding force ranging from 25gf to 200gf
Supports Various Chip Sizes
Compatible with chips ranging from 0.15mm to 2.0mm
General Specification
| Index Time | 0.20 sec/cycle |
|---|---|
| UPH | 16.000 ea/hour |
| Lead Frame | Horizontal Lead Frame |
| Bonding Method | Epoxy Adhesive |
| Chip Size | 0.15 ~ 2.0 mm |
| Bonding Accuracy | ±25um / Theta : ±3˚ |
| Bonding Force | 25gf ~ 200gf Digital Control |
Material Size
| Lead Frame | Length : 100 ~ 280 mm |
|---|---|
| Width : 30 ~ 100mm | |
| Thickness : 0.1 ~ 1.9 mm | |
| Wafer | 4 ~ 8 Inch |
Utility
| Power | AC220V 50/60Hz 20A 1Φ |
|---|---|
| Dimension | 1460(W) 1000(L) 1750(H) |
| Weight | 1,750Kg |
Unit Specification
| Loader | Frame Automatic Supply Method(Magazine) |
|---|---|
| Feeder | Shaft Linear Motor Horizontal Drive(3Motor) |
| Chuck(Grip) L/F Clamp Method | |
| Rail Width Adjustable Type | |
| Unloader | Magazine |
| Wafer Stage | Adapt To Customer / Option : ⊝ |
| Chip Recognition | 9,3,1ea Chip Mode |
| Head | Bonding Force Controlled by Voice coil |
| One Touch Collect Switch Type | |
| Chip Pick Up Check By Vacuum | |
| Bonding Level Auto Detection | |
| Eject | Sheet Absorption By Vacuum |
| Vision | Wafer Vision : 0.5X ~ 3X Zoom, LED Lights Mount Vision : 0.5X ~ 3X Zoom, LED Lights |
