A Legacy of Innovation in Semiconductor Automation
Starting with the development of LED Die Bonders and Test Handlers, we quickly expanded our expertise to Probe Machines, RF Filters, and full-scale automation solutions.
2021
• Development of Auto Wafer Probe Equipment
2020
• Development of Dipping Bonder (UPH:15000EA)
2019
• Development of WLP(Wafer level package) Test Handler
2018
• Wave Guide Filter Tuning Machine Development & Mass Production
• Tape Jig Bonder Development
• 5G Cavity Filter Tuning Machine Development
2017
• MF Inspection Machine Development & Mass Production
2016
• Coil Mount Development
2015
• Development of Coil Winding Machine, Development of Cavity Filter Tuning Machine
2014
• Development of Blank Inspection Machine, Development of Flip Chip Bonder
2013
• Wafer taping machine development
2012
• Screen Printer Development
2011
• Establishment of R&D Center
• Patent submission for 2 types of Die Bonder
Patent submission for 2 types of Test & Handler
• Acquisition of ISO9001, ISO4001
• Development of Thermistor Mount
2010
• Supplied 200 LED Die Bonders to 15 domestic customers
• Developed Crystal Handler & supplied SAMSUNG-ME
• Established Chinese corporation
2009
• Establishment of SFE CO,.LTD, supplying 200 LED Die Bonders to 15
domestic customers
• Development of LED Die Bonder, evaluation of SAMSUNG LED
• Development of Eutectic Die Bonder & supply of RF-Semi
• Development of Test Handler & supply of R/F semi
• Development of SAW Filter Handler & supply of WISOL
