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- sfe@super-sfe.co.kr
- +82 041-566-3070
High-Speed, High-Precision Automated Testing Solution
Wafer Probe Machine: Super650
High-Speed Processing
Achieves over 30,000 UPH, maximizing production speed and efficiency.
6-Side AI Vision Inspection
Equipped with AI-based top and side vision systems for real-time defect detection and alignment accuracy.
Automated Loading system
Fully automated loading and unloading system enhances workflow and reduces manual operation time.
Intuitive Touchscreen Interface
User-friendly 17-inch color touch panel provides easy control and real-time monitoring.
General Specification
| Machine Type | Full Auto Probe Station |
|---|---|
| Application PKG | Saw Filter / ETC |
| Tact Time / UPH | 0.135 sec/die Max 26,666 die/hour |
| Probing Accuracy | Less than 3 ±μm |
| Wafer Stage | 8 Inch (General / Porous Type) Flatness: Less than ±10 μm |
| One Cassette | General Stack Type |
| Wafer Feeder | Dual Arm Transfer |
| Probe Card | Customer Specification / Card Development & Supply |
| Vision System | Wafer / Pin / Contact Vision |
| One PC System | Machine / Vision / Analysis / MES Software Support |
| Monitor | 19” Touch Monitor (MC OS) 21” Monitor (Analyzer OS) |
General Specification
| Device Recipe | 1 ~ 999 ea Recipe File Parameter & Vision ROI Load/Save |
|---|---|
| Wafer Stage |
Wafer: 4 ~ 8 Inch General Stage: Non Sawed Wafer Stage Heater: 25 ~ 150℃ Ring Wafer: 4 ~ 6 Inch General Stage: Non Sawed Wafer Porous Stage: Sawed Wafer |
| Vision System |
Wafer Vision (High/Low Magnify 高低倍率) Probe Pin Vision (High/Low Magnify 高低倍率) Contact Die Vision (Using The Center-Open Card) |
| Auto Height Measure & Focus |
Wafer Pre-Align Vision |
| Barcode Read |
Ring Wafer Barcode: 2D, QR Mark Pure Wafer Barcode: 2D, QR Mark |
| Saw Blade Wafer | With Porous Stage (Option) (Probing Accuracy ±8μm) |
| Multi Die Contact | Support |
| Network Analyzer / Wave Judge S/W | Support (Rohde / KeySight) |
| MES S/W | Support |
| Multi Language | Change Immediately (韓中英) |
